Hi folks, We're looking to solder a micro-PGA socket to an existing NSD BGA pad pattern. The pins on the micro-PGA socket are round, I don't have the exact size but for discussion sake say they are half the size (in diameter) of the BGA pads. The end of the round socket pins are flat and will butt against the BGA pad. Solder should (hopefully) wet fully to the BGA pad and around the circumference of the pin. Our BGA is 225 pins and approximately 1.1 square inch. Anyone with experience doing this out in Technet-land? How reliable will a butt solder joint like this be, say under cyclical temperature and/or vibration conditions? We're using a standard FR4 PWB with ENIG finish, assume socket carrier material has a similar Tce to FR4. Any insight/comments appreciated! Thanks. Best regards, Gregg Klawson General Dynamics Communication Systems Taunton, Massachusetts, USA mailto:[log in to unmask] The views expressed are the author's and do not necessarily reflect the official position of General Dynamics or any of its subsidiaries. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------