With the right procedure and HASL post clean the SIR can be as low as any other process. Gary McCauley -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Thursday, June 28, 2001 3:27 PM To: [log in to unmask] Subject: Re: [TN] **** PCB's - HASL -v- OSP In a message dated 6/28/2001 3:20:58 PM Central Daylight Time, [log in to unmask] writes: In addition, we all know that HASL is a nasty, dirty, filthy, rotton (fill in the descriptor of your choice) process and often leaves nasty, dirty filthy rotton residues behind. It does nasty things to insulation resistance. If you are going the no-clean route, HASL residues can kill your product and sometimes, users of your product. By comparison, OSP is a much cleaner process and does not impact insulation resistance. Amazing that any planes are still flying or equipment is still functioning after all these years of that "nasty" process that has provided adequate product. Susan Mansilla