Good Morning. Can anyone inform me if there is a standard (JEDEC or equiv) out there for tape and reel packaging of QFP or similar IC components. I am aware of the JEDEC 95-1 generic matrix tray design standard for supply of components on trays, but is there a similar standard for T & R. I'd appreciate any input Thanks, John --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------