We rely on process control for our BGA attachment. The solder paste process is monitored for thickness and uniformity of deposits. As long as the proper amount of paste is applied, the placement is accurate (vision assisted) and the reflow process is in control, then there should be no reason to x-ray, especially since x-ray will only show bridging, mis-alignment or missing solder. We only x-ray when we have a test failure. Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: Phil Bavaro [SMTP:[log in to unmask]] Sent: Tuesday, June 19, 2001 1:01 PM To: [log in to unmask] Subject: [TN] BGA Xray Inspection: 100% or SPC controlled Here is a question that many of you have had to deal with....... Do you xray image inspect 100% of your BGA solder connections or do you only process a sample of your production volumes thru xray or do you not require xray inspection unless a test failure occurs on the board? We have bgas on close to all of our boards these days and even with inline automatic xray equipment, it is becoming a bottleneck for production. I hesitate to release my xray inspection control on anything but extremely high yielding boards unless there is very high functional test coverage to ensure that we don't let bad product out of our facility. I am just wondering what the rest of the industry has adopted as a policy for this problem. Thanks in advance. Phil Phillip A. Bavaro QUALCO/\/\/\/\ Incorporated Manufacturing Engineer, Staff [log in to unmask] Cell (619) 602-8644 (offsite, after hours) Pager (619) 271-3640 Tel (619) 658-2542 Office/voice mail Cell (619) 845-9968 (workday) Fax (619) 658-1584 ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------