William, Besides the usual suspects (Loctite, Heraeus, etc), you might try MA-420 from Thermoset (http://www.thermoset.com). Seems to meet your requirements. Regards, Peter -- -------------------------------------------------------- Peter Swanson [log in to unmask] INTERTRONICS http://www.intertronics.co.uk INTERTRONICS is dedicated to providing quality material, consumable and equipment solutions to the electronics manufacturing and other technology based industries, with the highest levels of technical support and customer service. -----Original Message----- From: Mengers, William D. [mailto:[log in to unmask]] Sent: 19 June 2001 14:03 To: [log in to unmask] Subject: [TN] SMT adhesive Hi All, I am looking for an SMT adhesive with the following characteristics: 1. 1 part 2. Dispensible 3. Thermal (not sure of a number here) 4. Snap cure (re-flow) 5. Re-workable 6. Extended work life (prefer several days) 7. Will not lift parts during cure in re-flow oven) Please tell me I'm not asking for much. We are presently using LocTite 3615 which dispenses great, but happens not to be a "thermal" adhesive and is not reworkable. And, unfortunately, we have not matured enough to learn from our mistakes and get rid of re-work. Or even keep it to a minimum, but that is a story in itself. I would like to "stick" with a large company with plenty of resources, e.g. LocTite. Any reccommendations? Thanks for any info you can give, Bill Mengers Process Engineer Northrop Grumman Corp. Baltimore, Md. ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------