Hi all, I've got an extremely dense .093" max thick board which already utilizes .010" finished holes for the vias (~8000 vias on the board). It's currently using .023" pads for the external/internal layers. I'd like to decrease both pad sizes and still keep it manufacturable. Anyone have suggestions (aside from the "recommendation" to go to uVias!, ain't gonna happen). I'm looking to go with .020" pads external and .022 pads internal. This is not a production board. Anyone going smaller than .020/.022" pads? Thanks. Mitch _____________________________________________________________ Tired of limited space on Yahoo and Hotmail? Free 100 Meg email account available at http://www.dacafe.com --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------