Steve No you are not supposed to be able to do that. There is definitely no adhesion between the encapsulation and the wire bon pads. Regarding that you mentioned in your first mail that you want to look at the wire bond I assume that you had an open. After soldering? Looks to me as if you see something similar we see quite often in BGA's: Delamination in the solder-process due to humidity. Its a failure of the popcorn family. Have a great day Guenter Guenter Grossmann Swiss Federal Institute for Materials Testing and Research EMPA Centre for Reliability 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1823 4054 mail: [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------