I've been having an ongoing discussion with our QA Manager regarding the
wetting capabilities of No-clean versus Water-soluble solder pastes.  He
believes that no-clean wets better, I think the opposite. This is in an air
reflow environment. I'm curious as to what some of you might have to offer
on the subject?

Thanks in advance,



Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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