******* INFO: this is a copy of the original mail. Some of you might recieve this message now a second time. *************** Hi Rick, i just had a look at the Alterahomepage, because we want to use that part on a new board we are just designing. The thermally enhanced type has a ceramic heatsink on to top, covering all the componentarea. The component is additionally thicker (3.5 mm) than the typical -non enhanced- one (2.1 mm). So I don't have any experience on working with that part. But may be the reason for your problems lies in the combination of ceramic heatsink and organic substrate of the component. So I like to ask the other techies about their experience using such components with ceramic heat sinks. Frank Kriesch mailto: [log in to unmask] Web-Site: http://www.diehl.de http://www.diehl.com Rick Thompson <rthompson@VENTURAELECTR An: [log in to unmask] ONICS.COM> Kopie: Gesendet von: TechNet Thema: [TN] Altera BGA Reflow Problem <[log in to unmask]> 23.05.2001 18:19 Bitte antworten an "TechNet E-Mail Forum."; Bitte antworten an Rick Thompson Hi, We have an Altera fine pitch BGA that I'm having difficulty placing & soldering. I'm hoping someone may have experience with this particular part or can offer some suggestions. The part in question is an EP20K300 series in a 'thermally enhanced' 672 ball package. Pitch is 1mm. The package looks like an FR4 substrate with a layer of some sort of bonding material on top. I think it's probably the same as the 'glob-top' material except it covers the entire area of the part. The problem we're having it that the part appears to be 'cupping' down at the corners, causing shorts at the corners. Complicating this is the fact we're placing this on .018" thick PCB's. I've looked at our profiles on top and bottom and don't believe that the top is heating too much but we still get the cupping effect. Any experience with this chip or suggestions in general would be greatly appreciated. Thanks, Rick Thompson Ventura Electronics Assembly 2655 Park Center Dr. Simi Valley, CA 93065 +1 (805) 584-9858 x-304 voice +1 (805) 584-1529 fax [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- Der Inhalt dieser E-Mail ist für den Absender rechtlich nicht verbindlich. Informieren Sie uns bitte, wenn Sie diese E-Mail fälschlicherweise erhalten haben (Fax: +49-69-5805-1399). Bitte löschen Sie in diesem Fall die Nachricht. Jede Form der weiteren Benutzung ist untersagt. The content of this e-mail is not legally binding upon the sender. If this e-mail was transmitted to you by error, then please inform us accordingly (Fax: +49-69-5805-1399). In such case you are requested to erase the message. Any use of such e-mail message is strictly prohibited. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------