> Hi All, > I have problem to reflow thin plate (tab) of Ni200, the part easily peeled-off (<1kgf) for the soldering area of 3mx2mm. > Not all the while I have such such problem. Only 20-50% of the certain lot of nickel plate. > The Ni200 tab is tin platted elctrolitically, SEM check on the failure surface reveal the below % weight of element. > At Component side, > Nickel 12.4 [15.8] > Sn 50.8 [51.95] > Pb 9.7 [9.11] > Cu 11.5 [10.3] > > At PCB pad side, > Nickel 4.8 [6.6] > Sn 63.4 [69.13] > Pb 12.5 [10.35] > Cu 8.4 [6.4] > > Composition of bad unit is []. > > Voids is relatively higher on the breaking surface of bad unit. > Shall I say that the plating adhesion is still good since the breaking layer is not between tin plating to the Ni200 base material. > Manual soldering does not have such problem (peeling force >3.5Kgf). > > Need advise/help/recommendation on the further analysis to be carried out..... > > > > > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------