Bob, take this for what it's worth... On June 15, 1994, a report was issued from the Department of the Navy, Naval Air Warfare Center, subject entitled "Testing and Evaluation of HF1189 and HF1189A Soldering Fluxes on Stranded Wire". The report goes on as follows: "1. As a result of concerns from several military program managers and materials engineers; the Naval Air Warfare Center Weapons Division, China lake, California, Hughes Missiles Systems, Tucson, Arizona, and Texas Instruments Defense Systems and Electronics Group Missiles Systems, Lewisville, Texas, formed a joint study team to address the issues regarding the use of HF1189 and HF1189A water soluble soldering flux on stranded wires. The testing program was developed from the previous work found in references (a) through (e) and input received from a variety of Navy, Army and Air Force reliability, materials and product assurance engineers. This testing program was 21 days in duration under aggravated temperature and humidity conditions with an applied electrical bias (50% duty cycle). Detailed results of the testing are found in enclosures (1) through (3). 2. The key issue in this task was to determine if flux which may become trapped under the wire insulation from capillary action during soldering and post-soldering cleaning operations will induce corrosion which will negatively impact long term reliability. Detailed metallurgical analysis of the wires revealed no damaging corrosion or potential corrosion from these fluxes and residues. None of the data indicates that there will be any problems with reliability or performance when stranded wires are soldered with either of the subject fluxes. 3. Foreign substances found on sole of the terminals were chemically identified. Detailed metallurgical analysis indicated that these residues were benign. No evidence of serious corrosion which would degrade wire of terminal performance was found." Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group (formerly known as AIL Systems) [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: bbarr [SMTP:[log in to unmask]] Sent: Wednesday, May 16, 2001 2:11 PM To: [log in to unmask] Subject: [TN] Rework Wires and OA Flux Since OA flux residues are corrosive if not removed, how does one handle soldering rework wires to boards? Won't the flux wick under the insulation and cause a problem? Assume I do not have the option of using a no clean flux. Is my only choice an RMA chemistry with local cleaning (which is an option I have available if needed)? Any other ideas? Thanks. Bob Robert Barr Manufacturing Engineering Formation, Inc. ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------