Of course water soluble solder pastes wet better, the flux on those things is far more aggressive than what's on no-clean. That's actually the beauty of water-soluble you can almost solder anything, that's why is so much simpler process, although you have to wash, you don't have to worry too much on the condition of the components or boards been dirty. No clean is a better way of doing things, does not need to be washed, but you got to make sure the process is very good. My grain of salt -----Original Message----- From: Rick Thompson [mailto:[log in to unmask]] Sent: Wednesday, May 16, 2001 5:04 PM To: [log in to unmask] Subject: [TN] No-clean vs Water-soluble wetting? I've been having an ongoing discussion with our QA Manager regarding the wetting capabilities of No-clean versus Water-soluble solder pastes. He believes that no-clean wets better, I think the opposite. This is in an air reflow environment. I'm curious as to what some of you might have to offer on the subject? Thanks in advance, Rick Thompson Ventura Electronics Assembly 2655 Park Center Dr. Simi Valley, CA 93065 +1 (805) 584-9858 x-304 voice +1 (805) 584-1529 fax [log in to unmask] ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------