Howdy, I have got a major mess on my hands. We may soon be running a double sided SMT product that needs to be fully cleaned due to a conformal coating process. Both sides of the assembly have two 2" x 1" x .3" RF Shields that are soldered to the PCA. There are SMT components under the shield, and the shields have two .040" holes on top- the rest of the shield is sealed. Just in case we cannot clean 100% of the residue out of these shields, the customer requires a no-clean chemistry solder paste. (They claim no clean residue has caused problems with past due to issues with the battery pack...I am not much of an electrical guy, and cannot refute them). They are pushing us towards a vapor degrease cleaning method, since they had used the process sucessfully during the design phase with good luck. Question 1: If we did use a non aqueous solvent for cleaning, especially one that has evaporative characteristics (any HCFC replacement), could we avoid the "bake out" process? Question 2: Would a cold soak process with somthing like Bioact be a viable alternative- and be performed without a bake out? Question 3: Would ultrasonics be valuable (if we had alternating frequency such as with the Smartsonic system), or could more damage be done. Steve Abrahamson 208-898-2695 [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------