Steve, I have seen this problem before. What is likely happening is that you are curing the glue too fast. The outer layer of the coating skins over, entrapping volatiles. They then blow out, leaving a pathway between the pads. This pathway can fill with flux, and the solder naturally follows, creating a short. I wrote about it in two Process Rx columns in December 98 (Microcanyons), and a follow up column in July 99 (Become One With the Glue). And yes, there was a fair amount of drinking going on during title selection. I can send you those articles if you are interested. They also appear on CSL's website, www.residues.com/library. The client did are large designed experiment looking at single dot and double dot application, and different glue curing rates. They found that by following the manufacturers recommended glue cure profile, they got the best adhesion (imagine that, following directions actually works). Doug Pauls Rockwell Collins --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------