Hi technos,

once again I need to come to the wisdom fountain.
Please give me some input on the issue raised by our design group that
reads:

"I would like to know if we connect all the vias connected to plane (power
or ground) without thermal connection but with flood connection, if it can
cause any assembly problems (Thermal, stress, etc...). To help to reduce the
inductance of the vias we would like to connect these vias without thermal
connection".

Thank you,
Ioan

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