Hi technos, once again I need to come to the wisdom fountain. Please give me some input on the issue raised by our design group that reads: "I would like to know if we connect all the vias connected to plane (power or ground) without thermal connection but with flood connection, if it can cause any assembly problems (Thermal, stress, etc...). To help to reduce the inductance of the vias we would like to connect these vias without thermal connection". Thank you, Ioan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------