Hello Technetters, I am soon to design a PB for one of our customers that will be required to withstand a shock load of approximately 1500 g's. Does anyone have any guidelines or advice on how to achieve this? I'm thinking of solid potting the assembly within a rigid structure as one solution. Components are expected to include SMD discretes and BGAs. Of course there's the consideration of how hard the potting compound needs to be and what it should be (epoxy, silicone elastomer), as well as what material the board should be made of, CTE considerations between the board - components - compound - housing etc. Any advice would be most welcome. Phil Dutton C.I.D. Senior CAD Technician IPC Certified Interconnect Designer Tenix Defence Systems Pty Ltd Systems Division - Adelaide Second Avenue, Technology Park, Mawson Lakes. SOUTH AUSTRALIA 5095 ================================ Phone (08) 8300 4400 (reception) (08) 8300 4481 (direct) Fax (08) 8349 7420 email [log in to unmask] Internet Page http//www.tenix.com ================================ --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------