Hi all, What methods have any of you used for cross sectioning flip chip BGAs? We have a large flip chip die, attached to a thin interposer, and want to inspect the inside die bumps/joints. Our concern is with the brittle nature of the die and the lack of good support during the sectioning operation. The current option is to cut next to the die, mount sample in epoxy, and use 0.3 micron alumina for a very slow polish to the area of interest. Hopefully, somebody out there has dealt with this before and has a better idea. Thanks for all your help, Glenn --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------