Hi all,

        What methods have any of you used for cross sectioning flip chip
BGAs?

        We have a large flip chip die, attached to a thin interposer, and
want to inspect the inside die bumps/joints.  Our concern is with the
brittle nature of the die and the lack of good support during the sectioning
operation.  The current option is to cut next to the die, mount sample in
epoxy, and use 0.3 micron alumina for a very slow polish to the area of
interest.  Hopefully, somebody out there has dealt with this before and has
a better idea.

Thanks for all your help,

Glenn

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