Hi, We generally add copper pours to our boards for copper distribution and isolated traces and we tie these areas to ground. Does anyone have information on how this may relate to noise issues on the board? Is it different if the copper is floating. Does it change if it is on an internal layer or external. Does it change if it cross hatched or solid? Is there an IPC standard that discusses this? Thanks in advance, C. Anderson --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------