I'm unable to make a wire ultrasonic bonding (wedge bond) with Al wire 
directly to cupper pad.
With your permission, I'd be interested to known if this bonding is possible

Thanks in advanced


Josep M. Badia
Servei de Recursos Tècnics
Tèlf/Fax: 977 559630/559605
Univ. Rovira i Virgili

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------