I'm unable to make a wire ultrasonic bonding (wedge bond) with Al wire directly to cupper pad. With your permission, I'd be interested to known if this bonding is possible Thanks in advanced Josep M. Badia Servei de Recursos Tècnics Tèlf/Fax: 977 559630/559605 Univ. Rovira i Virgili --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------