Clayton, What is the lead plating? Copper corrosion products, primarily sulfides and chlorides (not oxides), have been known to migrate into the package as well as migrate between leads (causing increased current leakage or an electrical short). In order for migratory corrosion products to appear, you need chlorides and sulfides in the environment. This can be from leftover fluxes and other chemicals on the board or it can be from industrial gases (you'd be suprised how much chlorine gas you breathe in everyday). The corrosion products can only migrate into the package if there is a delamination between the encapsulant and the lead. Have you conducted acoustic microscopy of the component after reflow? If you want to qualify the components, you will need to run them through a typical solder reflow (with flux) and then subject it to either HAST or mixed flowing gas (MFG). As a general rule of thumb, if your cleaning process is thorough, your use environment is benign (controlled office) and your required lifetime is less than five years, these imperfections should not be a problem. However, if you have leftover flux on the board, you could see leakage problems in as little as six months. Craig -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Clayton Gardner Sent: Monday, March 12, 2001 8:13 PM To: [log in to unmask] Subject: [TN] Exposed Copper Hi All Can you please comment on the following Is there any associated/documented risk, if there are small plating imperfections on copper leaded SO08 components leaving a small section of exposed copper as the lead exits the component body?? We use IPC 610 Class 2 for this product. Our customer has concerns about the exposed copper leading to corrosion and entering the component body. Any help or info you can provide would be muchly appreciated. Thanks Clayton Gardner Engineering Manager AEMS 11-13 Fiveways Blvd Keysborough VIC 3173 AUSTRALIA Ph 61 3 9701 5499 Fx 61 3 9701 5422 email: [log in to unmask] web: www.aems.net.au ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------