> Subject: [TN] 3 point bend test > Date: Mon, 12 Mar 2001 12:54:05 -0600 > From: Hann Pang <[log in to unmask]> > Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask] > To: [log in to unmask] > > Hi Fellow Technetters, > > Has anyone ever heard of a "3 point bend test" that is performed on boards with SMT > components like BGAs, QFPs etc? Would appreciate any kind of info. thanks in advance! > > Hann > > 3M Hann, I'm not sure if this is the test you mean but we have done "torsional cycling" (mechanical deflection) on printed board assemblies. I'm not sure about the test details but I think they were supplied by the client who needed the work done. Contact me off-line and I can put you into contact with someone at our facility that knows more about the testing we have performed in the past. -- Brian McCrory Delsen Testing Laboratories, Inc. 1024 Grand Central Ave. Glendale, CA 91201 Phone: 818 247 4106 FAX: 818 247 4537 email: [log in to unmask] URL: http://www.delsen.com/ --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------