At this size I imagine weight would also be a concern. Mike ----- Original Message ----- From: "Kasprzak, Bill (sys) USX" <[log in to unmask]> To: <[log in to unmask]> Sent: Monday, March 26, 2001 1:25 PM Subject: Re: [TN] HUGE SMT assembly... > Guys, > > I'm really impressed by this 52, 42, and 60 layer discussion. I'm curious > though, are these boards like, .250" thick? Are they thicker? Do you have > any thru hole parts? Can you wave solder these puppies? > > Thanks. > > Bill Kasprzak > Moog Inc. > > > -----Original Message----- > > From: Earl Moon [SMTP:[log in to unmask]] > > Sent: Saturday, March 24, 2001 12:48 PM > > To: [log in to unmask] > > Subject: Re: [TN] HUGE SMT assembly... > > > > Well, you've really done it this time. I did 52 layer stuff that was half > > that size and 42 layer stuff 17x21 and one 60 layer that was 24x24 but > > through hole. Ain't it fun? > > > > For the 52 layer stuff, we did 1200 I/O devices as CCGA. For the 42, we > > did > > 3400 I/O MCM's with some interesting twists. Did them on Universal and > > Siemens. Mydata used at HP had the big capability for 24x24. > > > > Don't know why I'm discussting this but it is interesting. You sure know > > how > > to have fun. > > > > Any tornadoes yet, > > > > Earl Moon > > > > -------------------------------------------------------------------- ------ > > ------- > > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > > To unsubscribe, send a message to [log in to unmask] with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt delivery of Technet send the following message: SET > > Technet NOMAIL > > Search previous postings at: www.ipc.org > On-Line Resources & Databases > > > E-mail Archives > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > > additional > > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > > ext.5315 > > -------------------------------------------------------------------- ------ > > ------- > > -------------------------------------------------------------------- ------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > -------------------------------------------------------------------- ------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------