Hi Matt!
I noticed by your area code you're in the Bay Area, a really good person to
talk to
is a person named Dennis Johnson, he runs a company called "Onanon" over in
Milpitas...they got started by doing nothing but routing, scoring, and
drilling.
The contact info is:
Onanon Inc.
373 Sinclair Rd.
Milpitas, CA. 95035
Phone (408) 262-8990
Fax (408) 262-2901
www.onanon.com
They're just off of 880 over by Solectron. Dennis is very knowledgable in
this area, and if I remember right, 3COM asked him to do a study for them on
how close they could place a capacitor to a score line on a PCMCIA board and
not worry about fracturing a solder joint...
-Steve Gregory-
> Hello,
>
> I searched through the archives, but couldn't find much in the way of
> specifics (although a few good summaries of positives and negatives of the
> processes). We're looking to use score and break depanelization on a new
> product, and I was interested in finding out what design rules people are
> using.
>
> Our CEM tells us .040" from board edge to component body and .020" to
traces
> or pads when we use a "pizza cutter" type depanelization machine as this
> process doesn't cause too much stress on the board. Is this consistent with
> what others have used, and have the results been successful? Is this "pizza
> cutter" a standard tool that assembly shops have?
>
> What rules are used when just hand breaking the boards with a v-groove. How
> about with a breakaway tab ("mouse bite")?
>
> My main concern is not inducing any excess stress on the board or cracking
> any components/joints.
>
> Thanks for the assistance!
> Matt
>
> ~~~~~
> Matt Sanders - Trimble Navigation, Component Technologies
> [log in to unmask] <mailto:[log in to unmask]>
> Phone: 408.481.7965
> Fax: 408.481.2202
> Pager: 408.619.3899
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