Look at CSP on ceramic filled thermoset plastic substrates (RO4003) combined with laser drilled microvia technology. Its bleeding edge now so it should be state-of-the-art in 3 to 5 years. Jeffrey A. McGlaughlin, C.I.D. Sr. PCB Designer Battelle Memorial Institute Columbus Ohio [log in to unmask] -----Original Message----- From: Marsico, James [mailto:[log in to unmask]] Sent: Tuesday, March 13, 2001 2:04 PM To: [log in to unmask] Subject: [TN] ADVANCED PACKAGING MATERIALS AND TECHNOLOGIES Dear Technetters: This may be an unusual request, but here goes. I have an opportunity to work on an electronics packaging design from conception to production. The ground rule of this design is to use packaging, materials, processes and technologies which will be state-of-the-art 5 to 10 years from now. Everything from chassis materials, PWBs, assembly processes, component types, etc., to produce a product which is cost effective while maintaining high reliability. For me, immerging technologies include composite materials, high density interconnects, flip chip, flex circuits, micro vias, but I know these technologies are already established. What's new? I'm looking for a place to start. Any suggestions? Jim Marsico Senior Engineer Production Engineering AIL/Electronics Systems Group An EDO Company [log in to unmask] <mailto:[log in to unmask]> ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------