Woked at HP and minimum was, two years ago, 25 mils. Currently working at another large manufacturer with similar DFM study capabilities and data allowing no less than 20 mil spacing when I was just getting used to 50. Blows me away how this all works, and under what conditions as orientation, process capabilities, soldering requirements, etc.. Hell, how do you determine whether 15 mils works - do the experiment, over the next 12 months, and let us all know. Honestly, I'm with you. Push the envelope as far as you can and someone responds with a way to accomodate your "requirements." Great world we're living in unless you're snowed in in MA. Snow's no big deal as long as I can figure out glue dot size, placement accuracy, and compatible, with solder joint, cure cycles. Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------