Hi, Technetters

As we moved to smaller ceramic multilayer capacitors and resistors,(0603)we encounter an increase of tombstoning .

We checked our process-printing, reflow, layout, and did not find any other clues but the component solderablity- so it seems.

Due to very populated boards, the defect is seen quite often per board, but usually only one component /board.

Could you please tell me what is the acceptable number of this kind of defect, and how you record it, per board or per solder joints?

Thank you,

Gaby