We have had similar problems with the White Tin process. There appears to be an oxide or contaminate that occurs after more than one reflow operation. This inhibits the solder wetting. We are trying to get to the root cause. Our CM also recommended HASL for the same reasons. However, we don't feel that this will yield a planar surface. We are also looking at Immersion Silver or Nickel/Gold as alternatives. But they may have similar or different process issues. Regards, Spencer --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------