Outstanding, Appreciate the input. Earl ----- Original Message ----- From: "Galang, Jerry" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, February 06, 2001 3:44 PM Subject: Re: [TN] Chip device vs pad sizes > Earl, > Not sure what went on last year. We us a pad with full radius ends for our > 0603 and 0402 components. The rounded ends seem to pull the solder > perpendicular to the length of the component, very few 'tombstones' almost > no reports of end cap cracking, not bad for a million + boards a month. > What is our pad formula? If you design a 'standard rectangular pad' and > round the 'width' of the pad on both ends you have it. > > Jerry Galang > Xircom, Inc. > > -----Original Message----- > From: Earl Moon [mailto:[log in to unmask]] > Sent: Tuesday, February 06, 2001 2:20 PM > To: [log in to unmask] > Subject: [TN] Chip device vs pad sizes > > I'm still down sizing pads to mount/solder chip devices. We had a > conversation about mounting 0603's on 0402 pad configurations last year. I'm > still going with that with some modifications. Anyone have anything else to > contribute concerning increased reliability as fewer end cap cracking > problems and solder joint failures? It all goes back to the early '80's as > LCCC's and related stuff with TCE mismatch problems. > > Earl Moon > > Proof Of Design > > -------------------------------------------------------------------------- -- > ----- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET > Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- -- > ----- > > -------------------------------------------------------------------------- ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > -------------------------------------------------------------------------- ------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------