Many flip chip applications in the hybrid circuit world. Adhesive dispensed on alumina, or?, substrate. Die placed. Aluminum wedge wire bonding effected from flip chip circuit I/O's to substrate pads. Cover placed. Applications also in MCM and increasingly on PCB's directly. Differences being mostly wire bonding technique (gold ball, thermocompression bonding ensuring reduced heat to the PCB surface) and globbing the tops with some epoxy goop. Simple stuff really. Just bothers me that I went through three warrantied 1 gig PIII chips on my new computer because the heat sink was too tight a fit over the Intel inspired glob top and crushed the little bastards. You all see the size of the heat transfer area - tiny? Earl Moon Proof Of Design --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------