Many flip chip applications in the hybrid circuit world. Adhesive dispensed
on alumina, or?, substrate. Die placed. Aluminum wedge wire bonding effected
from flip chip circuit I/O's to substrate pads. Cover placed.

Applications also in MCM and increasingly on PCB's directly. Differences
being mostly wire bonding technique (gold ball, thermocompression bonding
ensuring reduced heat to the PCB surface) and globbing the tops with some
epoxy goop.

Simple stuff really. Just bothers me that I went through three warrantied 1
gig PIII chips on my new computer because the heat sink was too tight a fit
over the Intel inspired glob top and crushed the little bastards. You all
see the size of the heat transfer area - tiny?

Earl Moon
Proof Of Design

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