Had good success with Meg Array and Micropax SMT and through hole. The Micropax through hole was a little nightmare to rework at first. The Meg Array was a comparative breeze. SMT placement with any Meg Array version (low to high ball count and number or rows/columns) works well because of the little cap that is used to interface with the vacuum nozzle for placement and rework. The connector "forks or fingers," used to mate are a bit tricky but work well. The plastic body (what's the material) has good thermal properties so CTE presents no problem. The Micropax SMT connector series uses no balls for solder attachment. It's only big problem is the lack of a good alignment/board insertion pin so placement is a little difficult. Might be fixed by now. Don't forget a good rework plan as you don't want to go assemblin' without it. Earl Moon Proof Of Design --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------