This is how we specify IWT. IMMERSION WHITE TIN WITH A MINIMUM THICKNESS OF 0.65 MICRONS WITH A MAXIMUM THICKNESS OF 1.5 MICRONS Steve Collins "Marsico, James" <James.Marsico@D To: [log in to unmask] P.AIL.COM> cc: Sent by: TechNet Subject: Re: [TN] More about white tin (another question) <[log in to unmask] > 02/08/01 10:54 AM Please respond to "TechNet E-Mail Forum."; Please respond to "Marsico, James" Is the immersion tin process the same as electroless plating? How would one specify the IWT process on a board drawing? Is there a Mil spec or industry spec which can be referenced? Jim Marsico Senior Engineer Production Engineering AIL/Electronics Systems Group An EDO Company [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: <Rudy Sedlak> [SMTP:[log in to unmask]] Sent: Thursday, February 08, 2001 9:08 AM To: [log in to unmask] Subject: Re: [TN] More about white tin (another question) Ken: IWT, aka, immersion Tin, can be applied to any Copper based substrate. The plating process depends on Copper as a basis, and actually dissolves some Copper in the plating process. IWT will always be more expensive than electroplating, at least per pound of Tin Deposited, however the relative cost per square foot depends on how much Tin you are electroplating. Generally, IWT is a relatively expensive process, but since so little Tin is deposited, on such a small area on printed circuit boards, it becomes a detail cost. Rudy Sedlak RD Chemical Company ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------