I'm still down sizing pads to mount/solder chip devices. We had a conversation about mounting 0603's on 0402 pad configurations last year. I'm still going with that with some modifications. Anyone have anything else to contribute concerning increased reliability as fewer end cap cracking problems and solder joint failures? It all goes back to the early '80's as LCCC's and related stuff with TCE mismatch problems. Earl Moon Proof Of Design --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------