Hello, I am investigating the solderability of different elect. finishing of RF shields. So far I notice significant difference between tin and nickel finish. The particular 1"x1" brass shields with nickel plating that I am evaluating does not seem to have very good wetting at it's root and PCB junctions after reflow. The paste is alpha WS678. Does anyone else have solderability problems with nickel finish shields? What else would you recommend? Under what design concern/criteria would one select nickel finish? Thank you. Peter Process engineer __________________________________________________ Do You Yahoo!? Get email at your own domain with Yahoo! Mail. http://personal.mail.yahoo.com/ --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------