At my company, when I came here the glue of choice was Loctite 3609, dispensed from a GPD and cured through the normal reflow profile (230 or 240 C). I have not seen any fallout from this process. I am presently changing the process to stencil the glue, and I've done an experiment using Epibond 7275, and Amicon D 125 from Emerson & Cuming. These were cured in a Glue Profile with a peak temperature at 200 C for about 6 minutes, and the glue appeared just fine after cure. The Epibond 7275 had a slightly better pull test result, averaging 10.25 lbs. (this will depend on a lot of factors, like footprint, dot volume, etc).
By the way, the main requirement we have is that the glue is strong enough to hold the SMD on the bottom side of the PCB through wave solder. Not really that demanding! Hope this was of some help.
Howard Watson
Manufacturing Engineer
AMETEK/Dixson
Good day TechNet!
I'm looking for recommendations today. I need an adhesive that I can dot dispense on circuit boards (Dispense head on a GSM-1) and cure in the same oven profile as a solder paste reflow profile. I've got a couple of parts that need a bit of extra grip on the board (for vibration resistance). The parts are SMT paste attached, so the glue will have to cure at the same time as the paste reflows.
We currently run Loctite 3609 for our glue requirements, but I'm not comfortable running it through the higher temperatures of a reflow profile.
Can anyone recommend a suitable adhesive for this purpose? If you are the supplier please contact me direct, no SPAM to the TechNet please!
As always, Thanks! And a good weekend to all.
regards
Graham Collins
Process Engineer, Litton Systems Canada, Atlantic Facility
(902) 873-2000 ext 6215
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------