We're using Locktite Chipbonder 368. It is pin dispensed and cures during reflow. Jim Marsico Senior Engineer Production Engineering AIL/Electronics Systems Group An EDO Company [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: Graham Collins [SMTP:[log in to unmask]] Sent: Friday, February 23, 2001 1:47 PM To: [log in to unmask] Subject: [TN] SMT adhesive Good day TechNet! I'm looking for recommendations today. I need an adhesive that I can dot dispense on circuit boards (Dispense head on a GSM-1) and cure in the same oven profile as a solder paste reflow profile. I've got a couple of parts that need a bit of extra grip on the board (for vibration resistance). The parts are SMT paste attached, so the glue will have to cure at the same time as the paste reflows. We currently run Loctite 3609 for our glue requirements, but I'm not comfortable running it through the higher temperatures of a reflow profile. Can anyone recommend a suitable adhesive for this purpose? If you are the supplier please contact me direct, no SPAM to the TechNet please! As always, Thanks! And a good weekend to all. regards Graham Collins Process Engineer, Litton Systems Canada, Atlantic Facility (902) 873-2000 ext 6215 ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------