Currently we are experiencing solder bridging on a 0.5mm pitch, LQFP, 144 leads. I already reviewed the stencil design, screen printer parameters and reflow profile. Everything is OK. We have HASL boards. Our current process outputs 38 dpmo's. My concern is if I reduce more the apertures, I have the risk to have solder open or insufficient solder, instead of bridging. Does anybody has some input? What dpmo's do you have? --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------