Depends on which type of BGA, but most PBGA's with SN63 solder balls can be attached with some paste flux. Tom At 09:43 AM 2/5/01 -0500, you wrote: >Hi all. >I have a question about reworing BGAs. Do you have to reprint the solder >paste before placing the component or can you lay down some flux and rely on >the solder balls of the BGA? >Thanks in advance > >Trevor Goddard, >SMT Supervisor >XLTEK >(905) 829-5300 x 348 >[log in to unmask] <mailto:[log in to unmask]> > >--------------------------------------------------------------------------- ------ >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >--------------------------------------------------------------------------- ------ > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------