Kevin, This sounds to me like it might be what IBM called a "double reflow" failure. Is the crack a clean fracture right at the pad intermetallic surface? Does the part see additional thermal excursion either through wave solder or maybe repair of nearby components. I would be interested in seeing a picture. Send it to [log in to unmask] Thanks, Robert Furrow New Product Engineering Lucent Technologies 978-960-3224 [log in to unmask] > -----Original Message----- > From: Kevin Stokes [SMTP:[log in to unmask]] > Sent: Friday, February 16, 2001 8:33 AM > To: [log in to unmask] > Subject: [TN] Wetting issues... > > Everyone, > > I'm having an interesting problem with fall out from production. There is > one leg on one component in one position (with others of the same > component with no problem) that appears to have a wetting problem. > However, the fillets are well formed (not beaded up). There is a crack > under the solder pad, though. Also, the solder has a flaky appearance. > If you are interested, I could send a picture of the joint directly to > your email, let me know. We've had about 10 failures in production with > one field return already. > > Thanks, > > Kevin > > Kevin Stokes > Reliability Manager > Kimball Electronics Group > [log in to unmask] > (812) 634-4207 > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------