Kevin,

This sounds to me like it might be what IBM called a "double reflow"
failure. Is the crack a clean fracture right at the pad intermetallic
surface? Does the part see additional thermal excursion either through wave
solder or maybe repair of nearby components. I would be interested in seeing
a picture. Send it to [log in to unmask]

Thanks,
Robert Furrow
New Product Engineering
Lucent Technologies
978-960-3224    [log in to unmask]

> -----Original Message-----
> From: Kevin Stokes [SMTP:[log in to unmask]]
> Sent: Friday, February 16, 2001 8:33 AM
> To:   [log in to unmask]
> Subject:      [TN] Wetting issues...
>
> Everyone,
>
> I'm having an interesting problem with fall out from production.  There is
> one leg on one component in one position (with others of the same
> component with no problem) that appears to have a wetting problem.
> However, the fillets are well formed (not beaded up).  There is a crack
> under the solder pad, though.  Also, the solder has a flaky appearance.
> If you are interested, I could send a picture of the joint directly to
> your email, let me know.  We've had about 10 failures in production with
> one field return already.
>
> Thanks,
>
> Kevin
>
> Kevin Stokes
> Reliability Manager
> Kimball Electronics Group
> [log in to unmask]
> (812) 634-4207
>

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