Gents & ladies of TechNet,
        I would appreciate your assistance in a quick survey of pre-clean
options prior to application of photoimageable soldermasks. If possible
could you send me your answers to the following questions:

1) What preclean system are you currently using (e.g., pumice, silicon
carbide brush, microetch)?
2) If microetch, what chemistry type (e.g., persulphate, ferric chloride,
sulphuric/ peroxide, etc)?
3) Are there any plans to change the existing methods, and if so what are
the drivers and what would you be changing to?

Any responses would be gratefully received!

Thanks in advance,
        David Albin

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