Scott- Kathy's on the mark, but these two things have been most important to me: 1. you don't want to reflow your topside components for any great length of time, unless your touch up and test people really need lots more to do. I would add time/temp topside after wave just to make sure. 2. You want to make sure you're not activating your flux prior to wave. No cleans are a more sensitive to this than other types, but check the mfg data to get an exact temp. You'll know if you've exceeded this by the spiderwebbing, icicles, and shorts- similar to not having flux because you cooked it off before the wave. If you manage to get those two things right, and get a nice curve from room temp to just before wave, thermal shock shouldn't be a huge issue under most circumstances. Then you can adjust and optimize for throughput, keeping in mind that denser assemblies will take a little longer for a better soak. Good luck! Bill -----Original Message----- From: Rougeux, Scott [mailto:[log in to unmask]] Sent: Thursday, February 15, 2001 10:23 AM To: [log in to unmask] Subject: [TN] Thermal profiles at wavesolder Good Morning Technet. I posed a question recently on attachment method for thermocouples at wave solder.......Thank-You for your much diversified answers... I have another question: In the wave solder machine at what point do you log your measurements? Before it enters the fluxer/after it leaves the wave/etc/etc. What are you measuring?: dwell time slope thermal shock topside board temp Thanks! ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------