Hi, Technetters
As we moved to smaller ceramic multilayer capacitors and resistors,(0603)we
encounter an increase of tombstoning .
We checked our process-printing, reflow, layout, and did not find any other
clues but the component solderablity- so it seems.
Due to very populated boards, the defect is seen quite often per board, but
usually only one component /board.
Could you please tell me what is the acceptable number of this kind of
defect, and how you record it, per board or per solder joints?
Thank you,
Gaby