Spencer, We have used Entek 106A with good success from a solderability standpoint. The problems we encountered were : 1. ICT probes tend to get "gummed" up frequently from the OSP. We fixed this problem by adding all TPs to the solder stencil so we had a solder contact surface. 2. Some of our boards require large grounding surfaces and the OSP does not make for a good conductive coating or it gets washed away and the copper then oxidizes and contact is not acceptable. These were reason enough to change to a metal finish. DT -----Original Message----- From: Spencer Davis [mailto:[log in to unmask]] Sent: Tuesday, February 13, 2001 6:48 AM To: [log in to unmask] Subject: [TN] Entek OSP What are the fabrication, assembly and test issues associated with Entek OSP vs other finishes. We want to use it for double sided surface mount assemblies. Spencer Davis Sr. Manufacturing Engineer Spinnaker Networks, Inc. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------