Spencer, The biggest issue we have found using an OSP coating is not so much with the coating itself, but with the inability of the assembler to know whether there are contaminants on the pad prior to OSP application. This results in defects at assembly that can not be determined until parts are already applied to the board ($$). The pads that did not wet at all can be scraped and repaired, but it is difficult to determine if there are areas that appear to wet but also have partially contaminated pads and thus are reliability concerns. We generally end up junking product that exhibits this condition. I want to stress that these busts are infrequent, but you don't have to experience many junked assemblies to wipe out the benefits that OSP's provide. We also have found issues when using via in pad technology where the board vendor does not completely dry out the small vias. The OSP coating on the surface can then be compromised and again you have assembled product that must be junked. As far as test is concerned, if you do not cover the test points with solder either by wave solder or opening bottomside stencils, then you will need to optimize your tests sets to accommodate probe contact with the harder copper surface. If you would like to discuss further, please contact me directly. Thanks, Robert Furrow New Product Engineering Lucent Technologies 978-960-3224 [log in to unmask] > -----Original Message----- > From: Spencer Davis [SMTP:[log in to unmask]] > Sent: Tuesday, February 13, 2001 9:48 AM > To: [log in to unmask] > Subject: [TN] Entek OSP > > What are the fabrication, assembly and test issues associated with Entek > OSP > vs other finishes. We want to use it for double sided surface mount > assemblies. > > Spencer Davis > Sr. Manufacturing Engineer > Spinnaker Networks, Inc. << File: Spencer Davis.vcf >> --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------