It used to be that clipping into a through hole component solder joint was a no no because it could cause a fracture thus rendering the joint suspect. Concerning BGA rework, paste flux works as does solder paste because it ensures compliance from the board surface solder termination areas to the balls. Therefore, solder joints are formed. Ran thousands with SRT 1000 at HP and found no initial solder joint quality or long term reliability issues. Liquid flux don't get it. Also, raised SRT Pro nozzle up to .100" above board to get adequate hot air circulation but had to contend with adjacent component damage unless shielding in place. Finished 14 week Lean manufacturing adventure. Have 115 slide presentation available to those sending recordable CD and self addressed/stamped envelope. Pretty exciting stuff to me but maybe not to seasoned Lean veterans. Finally, am now working with Nortel/Antec joint venture as Arris Interactive. Doing what I love best as DFM/CE. Wonder if any old Nortel veterans still around (Bev) to say whether a DFM manual exists and available to associates? Got many DFM check lists, tons of IPC stuff that I follow to the letter, and some other non-specific stuff but would like not to re-invent the wheel. Thanks folks, Earl Moon Proof Of Design --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------