Dear technet, We are facing of delamination problem at reflow process. After assembly process (maximum temperature was 235C in IR-reflow), delamination was occurred between outer layer copper foil and dielectric layer of RCF. Construction of defective board was 1(RCF)+6(FR-4)+1(RCF). Our supplier is testing RCF, 260C*180sec by solder floating before shipping, and they said that did not found any problem. Delamination always happen between outer layer copper foil and resin. Also, dielectric thickness of defective boards was thinner than normal boards in the pattern area where many PTHs existed, and moreover, copper thickness of defective boards (included plating layer) was thicker than normal boards. We want to know relation the above-mentioned phenomenon and delaminaiton. Moreover, we want to know general cause of delaminaiton. Please advise us. Best regards, T.Ishino --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------