Hi All, We plan to begin fabricating multilayer boards on Rogers materials this year (probably 4320 & 4003). We currently use "double treat" FR4 cores and no longer have a black oxide line. I assume the double treat or oxide is there to promote bonding. Are there any suitable alternatives? Or should I start making space to set up the oxide line again? Thanks, Mark Hargreaves --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------