Charles, For reflow, if you use the 1210 stencil apertures for the 1206 package, you may be printing too much solderpaste, resulting in excessive solder, and possible solder balls beside the component. You may also experience some skewing as the part may "float" on the larger pad during reflow, however this may be only a cosmetic defect depending on your quality criteria. Reducing the stencil aperture will correct some of this, however you are likely to require a larger aperture than you would for a 1206 package due to the larger pad width. Howard A. Cyker Lucent Technologies Email [log in to unmask] Phone 978-960-2964 -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Monday, February 05, 2001 9:43 AM To: [log in to unmask] Subject: [TN] 1206 part on 1210 pads What would be the issues, assembly/solder, in using a 1206 resistor on a board laid out for a 1210 size? Thanks, Charles Lawson General Dynamics ATS ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------