We are considering replacing of our reduced black oxide and brown oxide innerlayer preparation by one of "conveyerised oxide substitions) . We made several preliminary tests and the samples were analysed by measuring of peel strength. The results were considerably lower compared to reduced black oxide laminated with epoxy prepreg and brown oxide laminated with polyimide.All "oxide substitute" suppliers reacted,that such results are expected,but performance of "oxide substitution" should be evaluated taking into account tests like solder float,steam test etc. I would like to ask PCB manufacturers,how they are controlling the properties of their "oxide substitution", especially on polyimides,thermount,RCC,teflon etc. Edward Szpruch Eltek , Manager of Process Engineering P.O.Box 159 ; 49101 Petah Tikva Israel Tel ++972 3 9395050 , Fax ++972 3 9309581 e-mail [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------