Steve, Ina very past life we produced a product similar. We were able to control the solder running and maintain the solder tension at the pad site by having the trace necked down considerably (bare minimum width) to force and create as large a solder dam as possible. Kathy >>> [log in to unmask] 01/10/01 07:15PM >>> Hey all, We've got a job in here that's going to be a few RF assembies. It uses surface mount in the design, but the board doesn't have any soldermask at all on the surface. The last time I dealt with something such as this, and tried to print solder paste, place components, and reflow, all I wound-up with is a bunch of tomb-stones, and insufficient solder all over the board because the solder wants to flow out all along the surface layer traces, and goes where-ever it wants to go...because there's no soldermask to contain it. I'll try to post a picture of what I'm getting ready to deal with on my free-drive tomorrow... This is not high volume at all, but from past experience it's my take that we should just hand solder stuff like this...because we'll wind-up touching-up everything anyway...have any of you ever dealt with stuff like this before? -Steve Gregory- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------