Harinder This is a good one for the archives. It's a topic that's been covered many times in the past. I recommend searching for "bak" to cover both bake and baking. You'll find a wide range of recommendations for time, temperature, materials and surface finish. > ---------- > From: Harinder Jassal[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Harinder Jassal > Sent: Thursday, January 25, 2001 2:40 PM > To: [log in to unmask] > Subject: [TN] PCB Baking > > Hi TechNetters, > > Is there any standard (IPC or otherwise) that details the requirements and > the process of baking bare PC boards prior to assembly? It is standard > practice to bake boards that have been stored in high humidity conditions > for long periods. These boards will have absorbed moisture and will need > drying before wave soldering to prevent outgassing. This should not be an > issue with surface mount boards that will be reflowed. Given that the > baking process will accelerate pad oxidization, is there any good reason > to bake SMT boards? > > Harinder Jassal > Manager, Manufacturing Engineering > Aimtronics Corporation (Delta) > Tel: 604-946-9666 > Direct: 604-940-5712 > Fax: 604-946-7611 > [log in to unmask] > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------